ENGLISH
3
The following values are show as a guide for each
application:
Soldering
small 300°C 1 - 2
components
Soldering
medium and 350°C 1 - 7
large comp.
Desoldering 300°C
small or 1 - 4
components 350°C
Desoldering 400°C 7
medium and or or
large comp. 450°C Maximum
Air
Flow
Temp.
The nozzles are removed from the heather through
the special bushing on the stand.
RECOMMENDATIONS FOR SOLDERING
AND DESOLDERING
In hot-air soldering and desoldering processes,
melting point is reached as a result of the heat
applied, the function of the air being to bring
the required heat to bear on the components. It
is therefore very important to select the lowest
possible air flow, and we recommend that the
heater be used without a nozzle whenever
possible, thus avoiding components being
shifted and solder being driven out.
3) Apply soldering cream (*) for SMD on the
circuit pad. For application we recommend our
model DP 6070 dispenser or any other available
on the market.
For soldering
Process for small SMD components of two or
three pins such as heating elements, capacitors,
transistors, etc:
1) If the component has been desoldered pre-
viously, any traces of solder left on the
circuit pads must be cleaned up by
desoldering-iron suction. We recommend our
desoldering station AR 5500.
2) Temperature 300°C, air flowrate 1-2.
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