Lenovo ThinkServer TS150 User Manual

Electrical current from power, telephone, and communication cables is hazardous.
To avoid a shock hazard:
• Do not connect or disconnect any cables or perform installation, maintenance, or reconfiguration of this
product during an electrical storm.
• Connect all power cords to a properly wired and grounded electrical outlet.
• Ensure that all power cord connectors are securely and completely plugged into receptacles.
• Connect to properly wired outlets any equipment that will be attached to this product.
• When possible, use one hand only to connect or disconnect signal cables.
• Never turn on any equipment when there is evidence of fire, water, or structural damage.
• Disconnect the attached power cords, telecommunications systems, networks, and modems before you
open the device covers, unless instructed otherwise in the installation and configuration procedures.
• Connect and disconnect cables as described in the following table when installing, moving, or opening
covers on this product or attached devices.
To connect: To disconnect:
1. Turn everything OFF.
2. First, attach all cables to devices.
3. Attach signal cables to connectors.
4. Attach power cords to outlets.
5. Turn devices ON.
1. Turn everything OFF.
2. First, remove power cords from outlets.
3. Remove signal cables from connectors.
4. Remove all cables from devices.
Statement 2
DANGER
Danger of explosion if battery is incorrectly replaced.
When replacing the lithium coin cell battery, use only the same or an equivalent type that is
recommended by the manufacturer. The battery contains lithium and can explode if not properly
used, handled, or disposed of.
Do not:
• Throw or immerse into water
• Heat to more than 100°C (212°F)
• Repair or disassemble
Dispose of the battery as required by local ordinances or regulations.
Statement 3
CAUTION:
When laser products (such as CD-ROMs, DVD drives, fiber optic devices, or transmitters) are
installed, note the following:
• Do not remove the covers. Removing the covers of the laser product could result in exposure to
hazardous laser radiation. There are no serviceable parts inside the device.
© Copyright Lenovo 2015, 2018 v

Lenovo ThinkServer TS150 Specifications

General

Bus type	DMI3
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1225V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	3.7 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	3.5 \
RAID levels	0, 1, 5, 10
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	2000 GB
Maximum storage capacity	24 TB
Number of HDDs installed	2
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 8 GB
On-board graphics card ID	0x191D
On-board graphics card model	Intel® HD Graphics P530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
PCI Express slots version	3.0
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	8 - 80 %
Power supply	400 W
Power supply input frequency	50 - 60 Hz
Redundant power supply (RPS) support	-
Chassis type	Tower
Operating system installed	Windows Server 2012 Foundation
Compatible operating systems	Windows Server 2012/2012 R2, Red Hat Enterprise Linux, SUSE Linux 11/12, Windows 10, Canonical Ubuntu 14.04, VMware vSphere 2015
Processor ARK ID	88168
Intel Secure Key Technology version	1.00
Intel® Hyper Threading Technology (Intel® HT Technology)	No

Weight and Dimensions

Depth	431 mm
Width	175 mm
Height	375 mm
Weight	12500 g