LG GB220 - Bluetooth and USB Connections; Bluetooth Setup and Device Pairing

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3.1.1 General
Technology:
– SoC, Monolithic, 65 nm CMOS
•Package:
– eWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls / 6-layer PCB
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ΣΔ-Transmitter
3.1.3 Baseband
•DSP:
– 156 MHz TeakLite™
•MCU:
– ARM1176® @ 208 MHz
•MCU RAM:
– 3.00Mbit
• Memory I/F:
– 512 Mbit (can be extended to 2 Gbit in AD-Mux/Demux, and up to 4 Gbit in AAD-Mux mode)
•Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
•Cipher Units:
– A51/2/3
–GEA-1/2/3
•Security:
– OMTP TR0
–Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
–OCDS disabling
– Certificate Management