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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
• Single chip 90 nm CMOS Bluetooth ROM solution
• Bluetooth 1.1, 1.2 and 2.0 specification compliant - up to HCI level.
• Enhanced Data Rate (2&3 Mbps)
• Future support for Bluetooth 2005 core release (software upgrade when Bluetooth specification will
be available)
• Enhanced host interfaces (UART, SDIO)
• Very low power consumption
• Pin-to-pin compatible with BRF6150
• On-chip Digital Radio Processor (DRP)
o Integrated 2.4 GHz RF transceiver
o All digital PLL transmitter with digitally controlled oscillator
o Near zero IF architecture
o On-chip TX/RX switch
o Support for Class 1 applications
• Embedded ARM7TDMIE Microprocessor System On Chip
o High rate H4 UART HCI
o High rate HCI Three Wire UART Transport Layer (H5)
o SDIO transport layer
o Flexible PCM and I2S interfaces: full flexibility for data order, sampling and positioning
o Automatic clock detection mechanism
o Patch trap mechanism that enables feature changes in ROM (ROM updates, improvements)
3.5.3 Bluetooth circuit Description
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