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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
• On-chip Power Management adapted to cellular application
o Direct connection to battery or external LDO 1.7 to 5.4V
o IO supply voltage - 1.62 – 1.89V
o Power saving mode
o Shut-Down mode to minimize power consumption when Bluetooth is not used
• Temperature detection and compensation mechanism ensures minimal variation in the RF performance
over the whole temperature range
• Seamless integration with TI OMAP™ application processor and GSM-GPRS-UMTS chipset
• Enhanced support for WLAN Co-existence (bandwidth sharing, antenna sharing)
• Spurious emissions compatible with GPS applications
• 5 external capacitors and balun/matching network required - total PCB area required only 45 mm2
(BGA package)
• Package: 4.5x4.5 mm size, 0.5 mm ball pitch, pb-free Micro Star Junior BGA package.
• Stacked RAM support with the same footprint as the ROM device (for development phase only)
• TI proprietary low power scan achieves paging and inquiry scans with fast RSSI algorithm, at 1/3rd
normal power.
3.5.4 Bluetooth Block Diagram
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