LG LG-P970 - Shooting a Quick Video

3. TECHNICAL BRIEF
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Only for training and service purposes
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3.10 Power Block
3.10.1 General
Since P970 uses two individual chips, XMM6160 (IFX Modem) uses integrated PMIC and OMAP3630 uses
TWL5034 as a main PMIC.
3.10.2 XMM6160 (IFX Modem)
X-GOLD™616 is a single integrated circuit UMTS/GPRS/EDGE Baseband Controller with integrated mixed signal
audio and measurement subsystem and modem power management unit. This system on chip designed in
Infineon’s low power 65nm CMOS process technology provides the performance to meet the ever increasing
demands of the cellular subscriber market for feature rich terminals at lowest power consumption and a very
competitive cost position.
Figure. LGP970 Modem Power Block Diagram
Power Block Diagram (CP)
VSD1
1.3V_CORE(450mA)
VDD CORE
PMB9801
VSD1
(450mA)
VSD2
(4450mA
)
VANA2
VDD_VPLL
VMIPI
1.8V_SD(450mA)
1.35V_PLL(30mA)
2.5V_ANA2(70mA)
1.2V_MIPI(60mA)
VDD
_
CORE
VDD_DIG / MEM
VDD_LVDS
VDD_MIPI_BGC
V
DD MIPI
PMB9801
VSD2
VDD_VRTC
VDD_VUSB
3.1V_USB(40mA)
2.3V_RTC(7mA)
_
VDD_USB
VDD_RTC
PMB9801
VRF1
VRF2
2.85V_RF2(60mA)
2.85V_RF1(180mA)
VDD_MAIN
VDD_FSYS
VDD_VAR
PMB5703
VDD VSIM
MEMORY
(for Infineon)
1G / 512Mb
VANA1
VDD_VPMU
2 85V SIM
PMB5703
VBAT
VDD
_
VSIM
(7mA)
USIM For Infineon
2
.
85V
_
SIM