LogTag UTRIX Work Instruction Manual Revision 1.07 MP Release Page 3/52
CONTENTS
REVISION HISTORY ..................................................................................................................................................... 2
CONTENTS ...................................................................................................................................................................... 3
SUMMARY FLOWCHART OF LOGTAG UTRIX ASSEMBLY .............................................................................. 5
MANUFACTURING PHASE 1: PCBA ASSEMBLY AND MOUNTING IN CASE ................................................................ 5
MANUFACTURING PHASE 2: FINAL ASSEMBLY & TEST ........................................................................................... 6
MANUFACTURING PHASE 3: LABELLING & SHIPPING ............................................................................................. 7
1 MANUFACTURING PHASE 1....................................................................................................................... 8
1.1 SMD MOUNTING ................................................................................................................................................. 8
Specific Components Required ........................................................................................................................... 8
Reference ............................................................................................................................................................ 8
Procedure ........................................................................................................................................................... 8
Special Notes ...................................................................................................................................................... 8
INSPECT ............................................................................................................................................................ 8
REFLOW TEMPERATURE ................................................................................................................................ 8
HANDLING PROCEDURES .............................................................................................................................. 8
1.2 PROGRAMMING (ICP) .......................................................................................................................................... 9
Reason for test stage: .......................................................................................................................................... 9
CORRECTIVE ACTION ..................................................................................................................................... 9
1.3 CRYSTAL MOUNTING ......................................................................................................................................... 10
Procedure: ........................................................................................................................................................ 10
1.4 CLEAN RESIDUE AROUND SENSOR CIRCUIT AND CRYSTAL AREAS ...................................................................... 11
1.5 SEPARATE PCBAS FROM PANEL ....................................................................................................................... 11
1.6 TEST & CALIBRATE UTRIX PCBA (TEST FIXTURE) .......................................................................................... 12
Reason for test stage: ........................................................................................................................................ 12
Equipment required: ......................................................................................................................................... 12
Setup: ................................................................................................................................................................ 13
Procedure: ........................................................................................................................................................ 14
CORRECTIVE ACTION ................................................................................................................................... 15
1.7 FIT USB CONNECTOR ........................................................................................................................................ 16
1.8 SOLDER USB CONNECTOR ................................................................................................................................. 18
1.9 MOUNT PCB IN REAR CASE ............................................................................................................................... 19
Procedure: ........................................................................................................................................................ 19
1.10 SOLDER USB CONNECTOR, ELECTRO-CAP & BRIDGE J1 ................................................................................... 20
Equipment Required: ........................................................................................................................................ 20
Procedure ......................................................................................................................................................... 20
Inspection .......................................................................................................................................................... 21
1.11 CONFORMAL COAT OVER ELECTRONICS ............................................................................................................ 22
Procedure: ........................................................................................................................................................ 22
2 MANUFACTURING PHASE 2..................................................................................................................... 23
2.1 FIT BATTERY AND SOLDER INTO PLACE ............................................................................................................. 23
Procedure ......................................................................................................................................................... 23
Inspection .......................................................................................................................................................... 23
2.2 ADD SEALANT TO CRYSTAL & CASE .................................................................................................................. 24
Procedure: ........................................................................................................................................................ 24
2.3 PRESS LIGHT PIPES INTO LED HOLES ................................................................................................................. 25
2.4 PRESS CASE HALVES TOGETHER ........................................................................................................................ 26
2.5 INSPECT CASE THICKNESS ................................................................................................................................. 26
Inspection .......................................................................................................................................................... 26
2.6 SCREW IN CASE SCREWS .................................................................................................................................... 27
2.7 PERFORM ‘USB LOGTAG TEST AND SETUP (USB)’ .......................................................................................... 28
Reason for test stage: ........................................................................................................................................ 28
Equipment required: ......................................................................................................................................... 28
Procedure: ........................................................................................................................................................ 30
Failures & Corrective action. ........................................................................................................................... 32
2.8 PUSH START BUTTON ........................................................................................................................................ 33
2.9 APPLY PROTECTION TAPE AND FIT USB CAP ..................................................................................................... 34
Reason for this step: ......................................................................................................................................... 34