LogTag UTRIX Work Instruction Manual Revision 1.07 MP Release Page 8/52
1 MANUFACTURING PHASE 1
The steps in manufacturing phase 1 produce product to a point where it is tested and assembled to a state
just prior to battery installation.
1.1 SMD mounting
Specific Components Required
• LogTag Rev1.2 PCB 170415
• Paste stencil matching to Rev1.2= PCB 170415
• Paste type ‘NO-CLEAN’.
Reference
• LogTag UTRIX 170415 component location map (See APPENDIX 1)
Procedure
• Place all SMD components as per component location map (see APPENDIX 1)
Special Notes
• If a No-Clean type solder paste has not been used then the PCBA will require cleaning to remove the
flux residues. (Switches may not be cleaned)
• Pasted panels to be stored horizontally before reflow at all times.
INSPECT
Visual Inspection using illuminated magnifying glass to check quality of solder
joints after reflow.
REFLOW TEMPERATURE
Perform regular oven temperature profiles to insure reflow soldering profiles are optimum.
HANDLING PROCEDURES
• All operators wear gloves when handling components or PCBAs
• ESD wrist-straps which are correctly grounded must be worn at all times.
• Work benches and test fixtures must be kept clean and tidy at all times.
• Work benches must be correctly grounded and have static mats and grounding points, which
are also correctly grounded
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