CM6200
412K855010 MIT
First Issue 2001.06
R
CM6200
Please use this service manual with referring to the user guide ( D.F.U. ) without fail.
Printed in Japan
CM6200 /F1N, /S1G
CD/MD Combination Deck
TIMER
SP
LP2MONO
LP4
REC MODE
EDIT MENU
DELETE
CANCEL
DUBB
DIRECT
-
CD/MD COMBINATION DECK CM6200
PHONES
PUSH ENTER
+
EASY JOG
RECMD
PLAY/PAUSESTOP
CD
PLAY/PAUSESTOP
POWER
ON/OFF
EJECT
CLOSE
OPEN/
STANDBY
CD-TEXT
TOC
REPEAT AUTO SYNC
1 A- B TOTAL TRACK
R
L
dB-50 -30 -22 -16 -12 -8 -4 0 OVER
PROG
RANDOM
DIGITAL
TABLE OF CONTENTS
SECTION PAGE
1. MAIN UNIT
1.1 TECHNICAL SPECIFICATIONS..........................................................................................................1-1
1.2 SERVICE MODE .................................................................................................................................1-2
1.3 TAKING OUT THE STACK DISC .........................................................................................................1-4
1.4 BLOCK DIAGRAM...............................................................................................................................1-5
1.5 SCHEMATIC DIAGRAM ......................................................................................................................1-7
1.6 PARTS LOCATION ............................................................................................................................1-13
1.7 WAVEFORMS.................................................................................................................................... 1-17
1.8 EXPLODED VIEW AND PARTS LIST ...............................................................................................1-19
1.9 ELECTRICAL PARTS LIST ............................................................................................................... 1-21
2. MDM-08BD( MD MODULE )
2.1 MD TEST MODE .................................................................................................................................2-2
2.2 ADJUSTMENT.....................................................................................................................................2-4
2.3 DISASSEMBLY AND REPLACEMENT .............................................................................................2-14
2.1 MD TEST MODE (Japan) ..................................................................................................................2-16
2.2 ADJUSTMENT (Japan) .....................................................................................................................2-17
2.3 DISASSEMBLY AND REPLACEMENT (Japan) ................................................................................2-27
2.4 WAVEFORMS.................................................................................................................................... 2-29
2.5 IC DATA.............................................................................................................................................. 2-31
2.6 PARTS LOCATION ............................................................................................................................2-38
2.7 SCHEMATIC DIAGRAM .................................................................................................................... 2-41
2.8 EXPLODED VIEW AND PARTS LIST ...............................................................................................2-43
2.9 ELECTRICAL PARTS LIST ............................................................................................................... 2-44
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