CONFIDENTIAL
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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints
Technical Services / SCCE Training Group Version 2.0 Approved
© 2004 Nokia Corporation
03/03/2004
© NMP 2004
Checked by:
SCCE
Approved by:
SCCE Training Group
General
-How to use this document
Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the
components and measuring points.
-Component characteristics
Some components contain important data such as tuning values or security data; therefore several steps
described are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain
cases. Please pay attention to separate notes.
-Broken balls / underfill, µBGAs
Reflow with uncontrolled hot-air fan is strictly forbidden! It is also not recommended only to reflow the old
µBGA using a µBGA rework station!
µBGA must only be soldered with NMP approved µBGA rework machines
(e.g. Zevac/ OK-Metcal/ Martin) to get durable soldering joints.
After removing a µBGA check soldering points; if necessary rework oxidated solderings (broken balls)
carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new component
remove the tin and clean the PCB; e.g. with help of solder wick and flux cleaner such as “Kontakt LR”.
Use only recommended flux type and an appropriate amount of it – avoid drowning the PCB in flux as this
will result in additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair
actions as the phone probably was exposed to strong mechanical stress.
“rework” done with uncontrolled hot air PCB drowned in flux Oxidated soldering
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