PalmSens EmStat3+ User Manual

Getting started with the EmStat3+ module for OEM 7
Getting started with the EmStat3+ module for OEM
2.2 Heat transfer
IC17 which is used for the 100 mA range, may dissipate about 1 Watt or even higher when the output
current limit is set higher.
It is therefore required to make a thermal connection from the bottom side of the PCB to something
which can absorb heat, for instance using the thermal pad WX-3009-0227-6 from 3M.
Suggested heatsinks:
Heatsink 24-pin DIP Glue-On BLK (508500B00000G) available on Digikey
An adhesive heat sink like BGA-STD-015 is available from Farnell (2084425).
When using the 100 mA range, it is required to make a thermal connection
from the bottom side of the PCB to something which can absorb heat like a
housing or heat sink.

PalmSens EmStat3+ Specifications

General

Brand	PalmSens
Model	EmStat3+
Category	Control Unit
Language	English