1. FEATURE CHART
2. CONTROL PANEL
3. OPERATION AND DIGITAL PROGRAMMER
CIRCUIT TEST
4. SCHEMATIC DIAGRAM
5. DESCRIOTION OF OPERATING SEQUENCE
6. STEAM FUNCTION (STEAM & MICRO POWER AND
Reheat with STEAM.)
7. CAUTIONS TO BE OBSERVED WHENCAUTIONS
TO BE OBSERVED WHEN TROUBLESHOOTING
8. DISASSEMBLY AND PARTS REPLACEMENT
PROCEDURE
9. COMPONENT TEST PROCEDURE
10. MEASUREMENTS AND ADJUSTMENTS
11. TROUBLESHOOTING GUIDE (NEW H.V.)
12. HOW TO CHECK THE SEMICONDUCTORS USING
AN OHM METER
13. EXPLODED VIEW AND PARTS LIST
3
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