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Puhui T-890 - User Manual

Puhui T-890
15 pages
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BGA IRDA WELDER T-890 USER MANUAL
BGA IRDA-WELDER USER MANUAL
MODEL: T-890
TAIAN PUHUI ELECTRIC TECHNOLOGY CO., LTD
http://www.tech168.cn
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Summary

Features

Technical parameters

Main parts

Description of the main parts

Details the various physical components and their functions.

Description of the main parts

Welding table main body

Details the main components of the welding table, including supports and chassis.

Front panel

Describes the components of the front panel, including display and controls.

Portal frame and lamp body

Details the portal frame and lamp body, including adjustment mechanisms.

Operating instructions

Examination and operation

Instructions for initial setup, power connection, and checking the LCD display.

Wave selection and setting

Guidance on selecting and setting temperature waves and preheat chassis settings.

Temperature wave purposes

Details the purpose and usage of each of the eight temperature wave profiles.

Attentions

Foundation for wave set

The reflow soldering theory and the temperature wave

Explains the principles of reflow soldering and temperature wave behavior.

The set of temperature wave

Guidance on setting temperature waves based on solder paste and PCB requirements.

Instructions

Examination and starting

Checks to perform before operating the machine.

Adjustment and preparatory work before sealing-off;repair

Steps for preparing the PCB board and adjusting the infrared lamp holder.

Adjust the infrared lamp temperature sensor

Procedure for correctly positioning the temperature sensor for accurate readings.

Sealing off;repair process

General sealing off process

Steps for sealing off components, including heating and chip removal.

General reflow process operation

Steps for reflow process, including cleaning, preheating, and welding.

Sealing off;repair various kinds of the components

Specifics for repairing components like CPU and GAP sockets, including heat protection.

Caution and direction when sealing off;repair process

Waterproof solid sealing compound

Handling chips with waterproof compound and temperature control precautions.

Big chip handling

Procedures for large PCBs like computer or XBOX motherboards.

Simple packaging chip protection

Using aluminized paper to protect simple chips from overheating.

Daily maintenance

Cautions

High temperature operation

Warning about operating the machine under high temperature conditions.

Power off when not in use

Instruction to disconnect power when the machine is not used for an extended period.

Warranty

Statement

Puhui T-890 Specifications

General IconGeneral
BrandPuhui
ModelT-890
CategoryWelding System
LanguageEnglish