LED New Light Source Reflow Oven T-960
solder paste will evaporate. At the same time, the flux can wet the pad and the
component tip and foot. The solder paste melts, caves in and covers the pad, leading
to the pad and component pins insulate the oxygen. PCB board goes into heat
preservation area. PCB board and components get full preheating. In case of
damaging the PCB and components when it goes into the welding area and the
temperature heats up quickly. When PCB board goes into the welding area, the
temperature heats up and the solder paste melts. When PCB board goes in to cooling
area, the liquid solder paste the soldering points solidify. The reflow process is
finished.
The temperature is the key to welding quality. The actual and the setting temperature
warming slope and the peak temperature should be accordant. Before the
temperature reaches 160℃, please control the heat up speed in about 1℃/S. If heat up
too quickly, the PCB board and the components will be damaged, and the PCB board
may be out of shape. On the other side, the flux volatilizes too fast. And it is easy to
make soldering tin ball. Set the peak temperature 20℃-40℃ higher than the solder
paste melting point. Set the reflow time 10S-60S. If the peak temperature is low or
the reflow time is short, it will affect the welding quality, and serious is causing the
solder paste does not melt. If the peak temperature is high or the reflow time is long,
the metal power will be oxidized and affect the welding quality and serious is
causing the component and PCB board damaged.
2. The set of the temperature wave
Set the wave according to the solder paste and the above foundation. Different solder
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