LTE Standard Module Series
4.7. ADC Interface ....................................................................................................................... 48
4.8. Indication Signal ................................................................................................................... 49
4.8.1. Network Status Indication ............................................................................................ 50
4.8.2. STATUS ....................................................................................................................... 50
4.9. Behaviors of the MAIN_RI .................................................................................................... 51
5 RF Specifications ............................................................................................................................ 53
5.1. Cellular Network ................................................................................................................... 53
5.1.1. Antenna Interface & Frequency Bands ........................................................................ 53
5.1.2. Tx Power ..................................................................................................................... 57
5.1.3. Rx Sensitivity ............................................................................................................... 57
5.1.4. Reference Design ........................................................................................................ 60
5.2. Reference Design of RF Routing .......................................................................................... 61
5.3. Requirements for Antenna Design ........................................................................................ 63
5.4. RF Connector Recommendation .......................................................................................... 64
6 Electrical Characteristics and Reliability ...................................................................................... 66
6.1. Absolute Maximum Ratings .................................................................................................. 66
6.2. Power Supply Ratings .......................................................................................................... 67
6.3. Power Consumption ............................................................................................................. 68
6.4. Digital I/O Characteristic ....................................................................................................... 78
6.5. ESD ...................................................................................................................................... 79
6.6. Operating and Storage Temperatures ................................................................................... 80
7 Mechanical Information .................................................................................................................. 81
7.1. Mechanical Dimensions ........................................................................................................ 81
7.2. Recommended Footprint ...................................................................................................... 83
7.3. Top and Bottom Views .......................................................................................................... 84
8 Storage, Manufacturing and Packaging ........................................................................... 85
8.1. Storage Conditions ............................................................................................................... 85
8.2. Manufacturing and Soldering ................................................................................................ 87
8.3. Packaging Specifications ...................................................................................................... 88
8.3.1. Carrier Tape ................................................................................................................. 88
8.3.2. Plastic Reel .................................................................................................................. 89
8.3.3. Packaging Process ...................................................................................................... 90
9 Appendix References ..................................................................................................................... 91
10 Warnings sentences ....................................................................................................................... 94
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