put in a dry environment such as in a drying oven.
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them
in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking
procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
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