EasyManuals Logo

Quectel EG21-G User Manual

Quectel EG21-G
96 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #76 background imageLoading...
Page #76 background image
LTE Module Series
EG21-G Hardware Design
EG21-G_Hardware_Design 75 / 100
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG21-G Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG21-G Module
Shielding Cover
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB)

Table of Contents

Other manuals for Quectel EG21-G

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the Quectel EG21-G and is the answer not in the manual?

Quectel EG21-G Specifications

General IconGeneral
BrandQuectel
ModelEG21-G
CategoryWireless modules
LanguageEnglish

Related product manuals