Quectel EG21-G - Packaging

LTE Module Series
EG21-G Hardware Design
EG21-G_Hardware_Design 83 / 100
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the 2D barcode is still readable, although white rust may be found.
8.3. Packaging
EG21-G is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The
figure below shows the package details, measured in mm.
30.3
㊣0.15
29.3
㊣0.15
30.3
㊣0.15
32.5
㊣0.15
33.5
㊣0.15
0.35㊣0.05
4.2
㊣0.15
3.1
㊣0.15
32.5㊣0.15
33.5㊣0.15
4.00
㊣0.1
2.00
㊣0.1
1.75
㊣0.1
20.20
㊣0.15
44.00
㊣0.3
44.00
㊣0.1
1.50
㊣
0.1
Max slope
2 to 3°C/sec
Reflow time (D: over 220°C)
40 to 60 sec
Max temperature
240°C ~ 245°C
Cooling down slope
1 to 4°C/sec
Reflow Cycle
Max reflow cycle
1
NOTES