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High-level overview of RK3288 processor, core features, and capabilities.
Details RK3288 features: CPU, GPU, VPU, memory, and peripheral interfaces.
Details recommended 6-layer and 8-layer PCB stack structures and specifications.
Outlines PCB design rules for EMI suppression, trace clearances, and component placement.
Recommends adding test points for debugging and factory SMT testing on specific signals.
Provides guidelines for silk-screen and decal design for clarity, debugging, and assembly.
Details schematic design for VDD_CPU, VDD_GPU power supplies and feedback connections.
Provides guidance on PCB layout for power supply, including copper areas and vias.
Offers specific PCB layout recommendations for SYR827 and SYR828 PMICs.
Details RC5T620 PMIC application and layout for battery solutions, including current limits.
Discusses ACT8846 PMIC solution for battery, highlighting stability and design demands.
Explains GPIO level matching and connection requirements for proper operation.
Details schematic for 24MHz crystal oscillator and load capacitors for CPU and PMU.
Provides PCB layout guidelines for the 24MHz crystal, emphasizing placement and ground connections.
Describes dual-channel DDR controller and DRAM interface, including data, address, and control signals.
Details PCB layout for DDR channels, including trace width, length, and impedance.
Explains schematic for Nand Flash, eMMC, and tSD, including voltage selection and pull-up status.
Provides PCB layout guidelines for Nand Flash and eMMC, focusing on thermal dissipation and trace routing.
Details TF card schematic for SD 2.0/3.0, including voltage and ESD protection.
Offers PCB layout for TF card interfaces, focusing on trace length and GND surrounding.
Describes RK3288 USB interfaces (OTG, HOST), compliant with USB specifications.
Provides PCB layout guidelines for USB, emphasizing trace placement, corners, and EMI reduction.
Details SarADC input for key-value sampling and RECOVER mode for firmware updating.
Offers PCB layout for key inputs, focusing on ESD protection and trace separation.
Explains DVP interface power and IO requirements for Camera, and timing considerations.
Provides PCB layout guidelines for DVP and MIPI sensors, focusing on trace length, impedance, and EMI.
Details RK3288 support for various display outputs: RGB, LVDS, MIPI, eDP, HDMI.
Offers PCB layout for MIPI, eDP, HDMI, LVDS interfaces, focusing on impedance and EMI.
Discusses eDP screen power, backlight ICs, and battery choice for different screen sizes.
Provides PCB layout for LCM, focusing on high-speed signal trace and component placement.
Describes the reserved debug UART interface for online software debugging.
Details I2S interface power supply and IO requirements for Audio Codec and SPDIF.
Offers PCB layout for Audio Codec and SPDIF, focusing on signal integrity and noise reduction.
Explains pull-up resistors for touch panel I2C and charge pump capacitor placement.
Provides PCB layout for touch panels, emphasizing ESD protection and signal separation.
Details sensor power domains and I2C pull-up requirements, and light sensor adjustment.
Offers PCB layout for light sensors, focusing on placement and illumination value considerations.
Describes eFUSE power supply circuit and recommends test points for burning.
Details MAC interfaces (RMII, RGMII) for Gigabit Ethernet and their schematic considerations.
Provides PCB layout for MAC interfaces, focusing on PHY placement, RJ45 connection, and EMI reduction.
Explains GPIO power supply for 4G modules and ESD protection for USIM sockets.
Offers PCB layout for 3G modules, focusing on USIM socket placement and trace width.
Details WIFI/BT module support for SDIO 3.0, UART, and voltage level matching for WiFi.
Provides PCB layout for WIFI modules, focusing on signal routing, placement, and impedance.
Offers PCB layout for GPS, emphasizing placement, interference avoidance, and antenna considerations.
Details NFC loop-antenna technology, current, packaging, and trace length considerations.
Provides PCB layout for NFC, emphasizing vertical layout to avoid impedance mismatch.
General| Architecture | ARM |
|---|---|
| CPU Cores | 4 |
| Memory Interface | 32-bit |
| Memory Support | DDR3, LPDDR2 |
| Operating System Support | Android |
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