PACKAGE INFORMATION
TX00153.002
SG Micro Corp
www.sg-micro.com
PACKAGE OUTLINE DIMENSIONS
TSSOP-28 (Exposed Pad)
Symbol
Dimensions
In Millimeters
A 1.200 0.047
A1 0.050 0.150 0.002 0.006
A2 0.800 1.050 0.031 0.041
c 0.090 0.200 0.004 0.008
D 9.600 9.800 0.378 0.386
D1 3.460 3.860 0.136 0.152
E 4.300 4.500 0.169 0.177
E2 6.200 6.600 0.244 0.260
e 0.650 BSC 0.026 BSC
L 1.000 BSC 0.039 BSC
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-153.
c
L1
θ
E
E2
D
b
e
A
A1
A2
5.94
0.650.42
1.78
RECOMMENDED LAND PATTERN (Unit: mm)
D1
E1
3.66
2.60
L