Sony CDP-470 - CDP-270;470 Diagrams: Layouts and Boards (Section 3)

CDP-270/470
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3-2. PRINTED WIRING BOARDS _ eel
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3-1.
SEMICONDUCTOR
LEAD
LAYOUTS
[MAIN
BOARD]
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18S202-1
cathode
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10E2 (Sw BOARD]
F om
cathode
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at =
anode =
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4 i {1/0 SWITCH BOARD] {LD MOTOR BOARD)
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SEMICONDUCTOR
LOCATION
i
7
i
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Ref.
No.
Location
Ref.
No.
Location
esl
DI E-10 C6 |-5 J
D3
J-9
C7
E-4
:
Ss
sh
D4 J-9 C8 D-5 | IN/OUT SW
D5 J-9 C9 D-3
P
D6
De?
0-3
{HP
BOARD]
D7 D-7 B-4
D8
D-8
C-7
wer
;
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C-7
-
J
- B-7
RV601
C-6 G-3
F-8 G-6
oa o : parts extracted from the component side. = a
= = : parts extracted from the conductor side. S14 $12 S16 $10 $13 Ss? $6 $2 Sé sit $16 s7 $3 S4 $1
1-9 H-3 : Jumper wire connected to the ground pattern on K [pesrinue | [SARE | see | eee) | b> ca [KK [ <4] Lees [ > aa | | SPACE | 4 ee | ae
PLAY MODE
the component side.
== =—e asi 2=2