Sony HCD-H700 - SECTION 1 SERVICING NOTES; GENERAL; DISASSEMBLY; MECHANICAL ADJUSTMENTS

Speaker section
Speaker system 3 way system
Speaker units
Woofer: 13 cm dia., cone type
Tweeter: 5 cm dia., cone type
Super tweeter: 2 cm dia., dome
type
Enclosure Bass reflex
Frequency range 60 Hz — 20 kHz
Sensitivity 88 dB/w/im
Rated impedance 6 ohms
Dimensions Approx. 195 x 285 x 230 mm
(7 5/8x 11 1/4x9 inches)
Weight Approx. 3.0 kg (6 Ib 10 oz)
net per speaker
General
=
Desti- Power Power
nation
|_
requirements
consumption
[ AEP 220- 230V
60 watts
nee AC, 50/60Hz
Tha
Us sabe ears 115 watts
[eanene! Nad
E 100V-120V
Sa em or 220V-
ut Arabia! 240V AC | 60 watts
Australian .
eel adjustable,
— 50/60Hz
Dimensions
Approx. 225 x 285 x 268 mm
(w/h/d)
(8 7/8x 11 1/4x 10 5/8 inches)
incl. projecting parts and controls
Weight
Approx. 6.2 kg (13 Ib 11 02)
Accessories supplied
AM loop antenha (1)
Remote commander (1)
Sony SUM-3 (NS) batteries (2)
FM lead antenna (1) (HCD-H700 only)
Speaker cords (2)
(HCD-H700, except for the UK
model)
Design and specifications subject to
change without notice.
Note
This appliance conforms with EEC
Directive 87/308/EEC regarding
interference suppression.
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT
label is located on the rear
exterior.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASERLAITE
KLASS t LASERAPPARAT
TABLE OF CONTENTS
Section itle Page
1. SERVICING NOTES Pee err a tee ee ee ee eer a 3
2. GENERAL ee ee ee ee ene Se eee ee SE ee ee ee TS 5
3. DISASSEMBLY
3- i. Case Re Ree ee a RC RAT Ee Ie ee ee ae eS 25
3-2. Power Block deals see's ilecer'Se\eie ove. 8 8's @c00aCe ee lere ae aye 25
3-3. Main Board 5 Sisie le. bse, b 4 cese vole sew Ae ya rete O Sueiecdc wherese Oars 26
3-4. CD Mechanism Block wom e cree rerecessenaersvece 26
3-5. TC Mechanism Block eee c eee cce eran esncrercns 27
3-6. Volume/MIC HP/Display/SW Board -::::--:-- 27
4. MECHANICAL ADJUSTMENTS ------s ccc ccc: 28
5. ELECTRICAL ADJUSTMENTS «-+s:+s-csssresctees 28
6. DIAGRAMS
6-1. Semiconductor Lead Layouts--:++ersssserere 34
6-2. Circuit Boards Location :+++++ssrrsserrr reese 35
6-3. Printed Wiring Boards —Main Section—--::: 37
6-4. Schematic Diagram —Main Section—-----++::: 41
6-5. Schematic Diagram —Sub Section— «-°-++':: 46
6-6. Printed Wiring Boards —Sub Section— :-:::: 51
6-7. Printed Wiring Boards —Display Section—:-- 56
6-8. Schematic Diagram —Display Section— ---::: 59
6-9. Schematic Diagram —BD Section—--:::+-"':: 62
6- 10. IC Pin Description ee ee 67
7. EXPLODED VIEWS
7-1.
Case,
Power
Section
«:srcrrtrrrteteeereeeeer
es
71
7-2.
Front
Panel,
Main
Board
Section
--+++:*+"'
+:
72
7-3.
MD
Chassis
Section-:::++erseretereseeeestei
es
73
7-4.
Mechanism
Deck
Section
(1)
-:trrerrter
ees
74
7-5.
Mechanism
Deck
Section
(2)
s+++rrtrererer
ts
75
7-6.
CD
Section
(l)errsr
rrr
eter
reece
eee
eee
cere
ee
16
7-7.
CD
Section
(2)-srrrseeeer
rere
rereeeeeee
rece
ee
77
8.
ELECTRICAL
PARTS
LIST
«++: esse
cr
eee
seer
cree
en
ee
78
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS
IDENTIFIED
BY
MARK
A
OR
DOTTED
LINE
WITH
MARK
A
ON.
THE
SCHEMATIC
DIAGR
AMS
AND
IN
THE
PARTS
LIST
ARE
CRITICAL
TO
SAFE
OPERATION.
REPLACE THESE COMPONENTS fVITH
SONY PARTS WHOSE PART NUMBERS APPEAH AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.