Sony HDCU1700 - HKCU2040 (Optional); HKCU2007 (Optional)

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Design and specifications are subject to change without
notice.
HKCU2040 (optional)
Design and specifications are subject to change without
notice.
HKCU2007 (optional)
Design and specifications are subject to change without
notice.
Supplied accessories
Number plates (1 set)
Operation guide (1)
Operation manual (CD-ROM) (1)
Optional accessories
AC power cord:
USA and Canada: 1-551-812-XX
Other countries: 1-782-929-XX
Power cord plug holder
USA and Canada: 2-990-242-01
Other countries: 3-613-640-01
HKCU2040 4K/HDR Processor Board
HKCU2007 3G/HD SDI Output Expansion Unit
HKCU1001 SD Encoder Unit
HKCU1003 Multi Interface Unit
CCA-5-3 Connection Cable (3 meters/10 feet)
CCA-5-10 Connection Cable (10 meters/33 feet)
RMM-301 Rack Mount Adaptor
Expansion Board
Maintenance manual
Related devices
HDC1700/2500/2400 Color Camera
RCP-1000 series Remote Control Panel
MSU-1000 series Master Setup Unit
CNU-700 Camera Command Network Unit
HZC-CSM10 Camera System Management Software
General
Power supply 23.5 W
Operating temperature –10°C to +40°C (+14°F to 104°F)
Storage temperature –20°C to +60°C (–4°F to 140°F)
Dimensions (w/h/d) DPR board: Approx. 19 × 110 × 226 mm
(3/4 × 4 3/8 × 9 inches)
DIF board: Approx. 19 × 98 × 159 mm
(3/4 × 3 7/8 × 6 3/8 inches)
HIF board: Approx. 19 × 98 × 159 mm
(3/4 × 3 7/8 × 6 3/8 inches)
Mass DPR board: Approx. 0.35 kg (12 oz)
DIF board: Approx. 0.15 kg (5.3 oz)
HIF board: Approx. 0.09 kg (3.2 oz)
Output connectors
DIF board
SDI OUT BNC-type (4)
12G-SDI: SMPTE ST2082, 0.8 Vp-p,
75 ohms, 11.880 Gbps/11.868 Gbps
3G-SDI: SMPTE ST424/ST425, 0.8 Vp-p,
75 ohms, 2.970 Gbps/2.967 Gbps
HD-SDI: SMPTE ST292, 0.8 Vp-p,
75 ohms, 1.485 Gbps/1.4835 Gbps
12G-SDI/3G-SDI/HD-SDI selectable
HIF board
SDI OUT BNC-type (4)
3G-SDI: SMPTE ST424/ST425, 0.8 Vp-p,
75 ohms, 2.970 Gbps/2.967 Gbps
HD-SDI: SMPTE ST292, 0.8 Vp-p,
75 ohms, 1.485 Gbps/1.4835 Gbps
3G-SDI/HD-SDI selectable
General
Power supply 5.5 W
Operating temperature –10°C to +40°C (14°F to 104°F)
Storage temperature –20°C to +60°C (–4°F to +140°F)
Dimensions (w/h/d) DRX board: Approx. 19 × 110 × 226 mm
(3/4 × 4 3/8 × 8 7/8 inches)
HIF board: Approx. 19 × 98 × 159 mm
(3/4 × 3 7/8 × 6 1/4 inches)
Mass DRX board: Approx. 0.24 kg (8 oz)
HIF board: Approx. 0.09 kg (3 oz)
Output connectors
HIF board
SDI OUT BNC-type (4)
3G-SDI: SMPTE ST424/ST425, 0.8 Vp-p,
75 ohms, 2.970 Gbps/2.967 Gbps
HD-SDI: SMPTE ST292, 0.8 Vp-p,
75 ohms, 1.485 Gbps/1.4835 Gbps
3G-SDI/HD-SDI selectable
Character ON/OFF selectable (connectors
3/4)