Sony TC-PB5 - Advanced MOS IC Safety Procedures; MOS IC Replacement and Testing Safety

TC-PB5
@ Take a short length of fine bare wire and Precaution while Checking C-MOS ICs
wind it around the IC so that it shorts all the
pins of the IC, while it is still in the urethane-
polyester cushion or aluminum foil. This
ensures that all the pins are at the same
The C-MOS ICs (Complementary MOS) are MOS
ICs that have their output sections made up of
N-channel and P-channel push-pull stages to increase
their speed of operation. If the output terminal of
potential.
these ICs comes into contact with B+ or B- voltage,
[aspondes
we
hookup
then
the
FET
which
is
ON
at
that
time
will
either
wire, etc.) become shorted or open.
This is valid for all the output sections that are
connected together by the interconnections. Even
the circuits that are physically separated (and not on
the same board) can be destroyed simultaneously.
Example:
partially conductive
urethane-polyester
cushion or aluminum
foil
If this line is grounded, or touches
B+ or B- bus..., the output stage
of this IC will be destroyed.
Fig. |
Fig. G
@ When it is necessary to handle the [C with
the fingers, do not touch any pin, and hold
the IC at the ends of its plastic-package case
as shown in Fig. H.
St,
Fig. H
Method of Mounting
Insert the IC while holding it with the modified
clip, and solder all the pins with the clip still
shorting the pins. (Similarly, solder all the pins
while the bare shorting wire is still wound
around them.). Remove the clip or the bare
shorting wire only after all the pins have been
soldered.
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