Operations Model 6DS-SP Planarizer
3 - 30 Version 4.0 - February 1998
Key Label Function(s)
Flush
Spndls
"Flush Spindles" Starts a long spindle flush cycle for both
spindles. The flush sequence is much longer than that used
during automatic operation.
Avoid aborting the spindle flush sequence. Instead,
always let the sequence finish to prevent leaving a
quantity of water in the backpressure system.
Clean
Carrs
"Clean Carriers" (Single table machines only) Starts a carrier
cleaning cycle.
Additional Features
PRESETTABLE WAFER POLISH COUNT:
This feature permits the operator to set the machine to polish a finite number
of wafers and stop automatically. Presettable wafer polish count is
applicable in the automatic (cassette to cassette) mode only.
Function key choices No. of Wafers and ALL Wafers show on the Auto
Polish Menu and the Polish Parameters Menu.
If No. of Wafers is selected, the prompt line will ask for a number of wafers
from 1 to 50. Once entered, this value will show in the Wfrs status area of
the screen. This value will be decremented by the number of spindles used
each time a polishing cycle starts. When it reaches zero, the machine status
will automatically change from In Polish Cycle to Finishing Cycle. When
the machine stops, the Wfrs status will automatically switch back to ALL.
If the machine is interrupted, it will remember the wafer count and resume
counting down when polishing is restarted.
If All Wafers is selected, the Wfrs status will display All and the machine
will polish wafers indefinitely.
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