Strasbaugh Operator Functions
Version 4.0 - February 1998 3 - 31
ODD WAFER POLISHING:
This feature permits a machine set for dual spindle polishing to polish a
single remaining (odd) wafer. This feature is applicable in the automatic
(cassette to cassette) mode only.
Odd Wafer Polish and Odd Wafer Time Adjust choices are available in
the Machine Parameters Menu.
If Odd Wafer Polish is disabled, this feature will not be used. If an odd
wafer situation occurs, the machine will stall and wait for another wafer after
loading the odd wafer on the left load station.
If Odd Wafer Polish is enabled, the machine will attempt to normally place
a wafer first on the left load station and then on the right for every polish
cycle. If, after placing a wafer on the left load station, no more wafers can
be found, the machine will polish the odd wafer using the left spindle only.
The Stat display will show Odd Wafer Polish when polishing begins. When
polishing is finished, the machine will automatically return to normal
polishing and either continue, if more wafers had been presented to the
machine, or stop if the machine still has no more wafers.
The Odd Wafer Time Adjust can be used to lengthen or shorten the polish
times for the odd wafer polish cycle. All times for both tables will be
multiplied by this value which is entered as a percent. The nominal value of
100 % will cause no change to polish times. During odd wafer polishing, the
adjusted times will show on the Auto Polish Menu.
DUAL BACKPRESSURE CONTROL:
Dual backpressure control permits setting the left and right backpressures in
the Polish Parameter Menu to different values.
This feature permits compensation for process related left/right differences.
It is not intended to mask other left/right differences due to machine
miscalibration or carrier differences.
To Next Page
Loading...
