Strasbaugh 6DS-SP - Page 237

Operations Model 6DS-SP Planarizer
4 - 34 Version 4.0 - February 1998
MENU ITEM DESCRIPTIONS AT THE MACHINE PARAMETERS
MENU (SCREEN PAGE 1)
Item Function(s)
Auto Cycle Operation
Auto
Manual
Condition
Sets wafer handling for fully automatic operation.
Sets wafer handling for manual wafer loading.
Used for spindle mounted conditioning devices.
Active Spindles
Both
Left
Right
Both spindles will be used.
Only the left spindle will be used.
Only the right spindle will be used.
Spindle Force Mode
Const Pres
Const Temp
Polish force will be maintained at the Polish
Parameter Menu values.
Polish force will vary to attempt to achieve a pad
temperature equal to the Pat Temperature value.
Pad Temperature
The target pad temperature if using the constant
temperature mode. Ignored if using the constant
pressure mode.
Backpressure
Enbl/Dsbl
Enables backpressure during polishing.
Polish Force Units
lbs
psi
Sets the units that polish force values represent.
Wafer Dia (if using psi)
This diameter is used to calculate force if “psi” is
used for force units. Ignored if “lbs” is used.
Left Force Scaling
Actual Left polish force will vary from the
programmed force by this percentage.
Right Force Scaling
Actual Right polish force will vary from the
programmed force by this percentage.
Osc. Stroke (TBLl, 6 max)
Sets the oscillation stroke for the primary table.
Osc Stroke (TBL2, 1 max)
Sets the oscillation stroke for the optional second
table.
Osc. Frequency (TBLl/TBL2)
Sets the number of oscillation strokes per minute.