Operations Model 6DS-SP Planarizer
4 - 40 Version 4.0 - February 1998
MENU ITEM DESCRIPTIONS AT THE MACHINE PARAMETERS
MENU (SCREEN PAGE 3)
Item Function(s)
Load Rinse During Polish
Interval
Steady
Conserve
Load stations will be rinsed at intervals.
Load stations will be steadily rinsed.
Load stations will not be rinsed.
Spindle Flushing
Enbl/Dsbl
Enables spindle flushing after wafer unloading.
Fountain Rinsing
Enb/Dsbl
Enables fountain rinsing after wafer unloading.
Tbl Start W/Slurry
(0-dsbl)
Causes the table to rotate during slurry prestart at
the rpm entered. A “0” entry disables the choice.
Rotate Prestart
Enbl/Dsbl
Cause the table and spindles to start rotating before
they are lowered onto the table.
Curtain Rinse
Enbl/Dsbl
Enables the optional curtain rinse.
Curtain Rinse Time
Sets the time each carrier will be curtain rinsed.
Table Rinse W/Curtain Rinse
Enbl/Dsbl
Enable primary table rinsing and rotating (fixed 10
rpm) during curtain rinsing.
Polish Time Entry
Left/Right
Matched
Polish times in the Polish Parameters menu can be
entered separately.
A polish time for either the left or right spindle will
be entered for both.
Backpressure Entry
Left/Right
Matched
Backpressures in the Polish Parameters menu can
be entered separately.
A backpressure for either the left or right spindle
will be entered for both.
Odd Wafer Polish
Enbl/Dsbl
Enables the odd wafer polish operation.
Odd Wafer Time Adjust
Sets the time adjustment for odd wafer polishing.
All polish times will be multiplied by this percent
during the odd wafer polish. They will return to
normal when odd wafer polishing is finished.
Post Polish Slurry Flush
Enbl/Dsbl
Enables slurry flushing after each polish cycle. If
post polish conditioning, the flush cycle will occur
after the conditioning cycle finishes.
To Next Page
Loading...
