Strasbaugh 6DS-SP - Page 281

Strasbaugh Troubleshooting
Version 4.0 - February 1998 5 - 23
WAFERS BREAK DURING POLISH CYCLE -
PART A
Problem
Indicator
Problem
Location
Component/ Cause Resolution/
Responsibility
WAFER
BREAKS
DURING
POLISH
CYCLE
Table
1) Debris on
carrier.
(2) Inserts and
wafer pads need
replacement.
(1a) Press the EMERG
OFF button.
(1b) Remove wafers.
(1c) Remove debris
from carriers.
(2a) Replace ring and
wafer pads.
OPERATIONS