Strasbaugh 6DS-SP - Page 282

Operations Model 6DS-SP Planarizer
5 - 24 Version 4.0 - February 1998
WAFERS BREAK DURING POLISH CYCLE -
PART B
Problem
Indicator
Problem
Location
Component/
Cause
Resolution/
Responsibility
WAFER
BREAKS
DURING
POLISH
CYCLE
Table
(4) Spindles and
load stations
misaligned.
(5) At the
Calibration menu,
read the value of
calibration
variable 171
(minimum liftoff
vacuum).
(6) Vacuum holes
in carrier blocked.
(7) Inadequate air
and vacuum at
spindle.
(4a) Realign spindles
and load stations.
(5a) Consider
lowering the value of
calibration variable
171 (set at the
Calibration menu) to
a value lower than the
current setting.
Lower the value in
increments of 1 PSIA
(or 1 PSIG) and test.
Repeat lowering and
testing as needed.
6a) Check/clean
vacuum holes in
carrier to permit air
and vacuum to pass
through freely.
(7a) Refer to the
spindle mechanical,
pneumatic, and
software calibration
adjustment
procedures found in
the 6DS-SP
Maintenance manual.
MAINTENANCE