Maintenance Model 6DS-SP Planarizer
4 - 6 Version 4.0 - February 1998
D. WAFER UNLOADING SEQUENCE
1. A test is done to make sure wafer(s) are on spindle(s).
2. The bridge moves to its load position.
3. If wafer cleaning is enabled:
a. The shuttle moves back.
b. The spindles move down into the cleaning stations.
c. The spindles rotate according to the wafer cleaning parameters set.
d. When wafer cleaning is finished, the spindles rise.
e. The shuttle moves forward.
f. The spindles move down to the load stations.
or
4. If wafer cleaning is not enabled, the wafer cleaning sub-sequence is
skipped.
5. The spindles move down to the load stations.
6. Vacuum is turned off, and blow off is turned on to the wafer.
7. The wafer falls into the load ring.
8. Blow off is turned off.
9. The spindles rise.
10. If time has been entered for wafer rinsing, wafers are rinsed.
11. The robot travel moves to its left/right load position.
12. The robot Z moves to its above load position.
13. The robot arm extends out over the load station.
14. The load chuck turns on vacuum and moves up.
15. The robot Z moves down to its left/right load position.
16. The robot vacuum turns on.
17. The load chuck turns vacuum off, releasing the wafer.
18. The robot Z moves to its above load position while holding the wafer.
19. The robot arm retracts back to its home position over the robot carriage.
20. The receive elevator moves to the next empty slot.
21. The robot travel moves to its receive elevator position.
22. The robot Z moves to its middle position at the receive elevator.
23. The arm extends into the cassette.
24. The robot turns off vacuum, releasing the wafer.
25. The robot Z moves from its middle position to its top position.
26. The arm retracts back to its home position over the robot carriage.
To Next Page
Loading...
