Strasbaugh Mechanical Description
Version 4.0 - February 1998 4 - 5
C. POLISH CYCLE SEQUENCE
1. The spindles move down to the table.
2. The polishing sequence begins.
3. Step 1 timing begins with spindles rotating at the programmed speed.
4. Spindle down force and back pressure on the wafer start to ramp up.
5. The cycle times out.
6. Down force is reduced to near zero.
7. Back pressure vacuum to the wafer is turned on.
8. When back pressure vacuum reaches the required level, the spindles lift off
the table.
9. If the second table option is not installed, the wafer unloading sequence
begins (refer to Section D, below).
10. If the second table option is installed:
a. The bridge moves to polish position over the second table if time has
been entered at the Polish Parameters Menu for the left or right spindle
in steps 11 through 20.
b. The polishing sequence begins.
c. Step 11 timing begins with spindles rotating at the programmed speed.
d. Spindle down force and back pressure on the wafer start to ramp up.
e. The cycle times out.
f. Down force is reduced to near zero.
g. Back pressure vacuum to the wafer is turned on.
h. When back pressure vacuum reaches the required level, the spindles lift
off the table.
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