Maintenance Model 6DS-SP Planarizer
4 - 4 Version 4.0 - February 1998
B. WAFER LOADING SEQUENCE
1. The send elevator moves to Slot 1.
2. The robot arm extends into the cassette.
3. The robot vacuum is turned on and the robot Z travels from its top position
to its bottom position.
4. The wafer sensor is checked to verify the presence of a wafer in the current
slot.
5. If no wafer is found, the vacuum is turned off, the robot Z moves to its top
position, the robot arm is retracted, the send elevator is indexed to the next
slot, and the process is repeated from step 2.
6. When the wafer is sensed, the robot Z moves from its bottom to its middle
position.
7. The robot arm retracts out of the cassette with the wafer.
8. The robot travel moves from the send cassette position to the left/right load
position.
9. The robot Z moves to its Z position above the load station.
10. The robot arm moves out over the load chuck.
11. The load chuck travels to its up position.
12. Vacuum at the load chuck is turned on to sense the wafer.
13. The robot Z moves from its position above the load station to its Z left/right
load position.
14. Vacuum to the robot vacuum chuck is turned off.
15. The robot Z travels from its left/right load station position to its Z above
load station position.
16. The robot arm retracts back to the arms home position over the robot
carriage.
17. Vacuum at the load chuck is turned off and the load chuck moves down
and seats the wafer.
18. When one or both wafers is seated in the load chuck(s), the spindles travel
down.
19. The load chuck and carrier vacuums are turned on, and the load chuck lifts
the wafer to the spindle.
20. The load chuck releases vacuum.
21. The load chuck goes down.
22. The spindle goes up.
23. The bridge moves to polish position over table 1 if time has been entered at
the Parameters Menu for the left or right spindle in steps 1 through 10. On
two table machines, the shuttle is retracted prior to the bridge move to table
1.
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