Strasbaugh Mechanical Maintenance Procedures
Version 4.0 - February 1998 9 - 13
CHANGING WAFER BACKING
INSERTS
Note: The procedure below is intended for three-, four-, five-, six-, and
eight-inch wafer carriers.
PROCEDURE
Turn machine power ON and perform home sequence:
1. Following procedures detailed in the Operator Functions chapter of the
6DS-SP Operations manual, power up the machine and perform the
home sequence routine.
Remove carriers from spindles:
2. Following procedures detailed in the Operator Functions chapter of the
6DS-SP Operations manual, remove the carriers from spindles.
3. Place carriers on a work bench bottom side up.
Remove insert and clean carrier:
4. Raise one edge of insert.
5. Peel the insert off by rolling to the opposite edge.
6. Discard the used insert.
7. Clean the carrier and dry with a soft cloth:
a. Feel the carrier by hand for adhesive residue.
b. Remove remaining residue with isopropyl alcohol.
c. Dry with soft cloth.