Maintenance Model 6DS-SP Planarizer
10 - 106 Version 4.0 - February 1998
7. Measure:
GOAL FOR STANDARD
MACHINES:
The Actual Distance from the top of the
load CHUCK to the bottom of the wafer
must equal .1875 in.
GOAL FOR MACHINES
EQUIPPED WITH A SECOND
POLISH TABLE:
The Actual Distance from the top of the
load RING to the bottom of the wafer
must equal .090 in.
a. For standard machines, measure the Actual Distance from the top
of the load chuck to the bottom of the wafer.
or
For machines equipped with a second polish table, measure the
Actual Distance from the top of the load ring to the bottom of the
wafer.
b. Record the measurement.
Example:
Actual Distance = .125 in.
c. If the Actual Distance meets the goal, no adjustment is necessary.
Go on to the Robot Up/Down Left Load Position procedure below.
d. If the Actual Distance does not meet the goal, make the needed
adjustment by following the steps in the Adjustment Procedure
section below.
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