Operations Model 6DS-SP Planarizer
2 - 22 Version 4.0 - February 1998
Conditioning/Cleaning Parameters Menu
Some of the parameters that determine the pad conditioning cycle are set
here. For further information, refer to the Machine Setup chapter of the
6DS-SP Operations manual.
Machine Parameters Menu
The most commonly changed parameters for machine operation are set at
this menu. For further information, refer to the Machine Setup chapter of
the 6DS-SP Operations manual.
Alarm Parameters Menu
Polish parameter alarm limits that are monitored during polishing are set at
this menu. For further information, refer to the Machine Setup chapter of
the 6DS-SP Operations manual.
Machine Setup Menu
Machine settings that affect machine operation but not processing are set at
this menu. For further information, refer to the Machine Setup chapter of
the 6DS-SP Operations manual.
Manual Control Menu
Every system involved with wafer handling may be manipulated individually
at this menu. For further information, refer to the Software Calibration
chapter of the 6DS-SP Maintenance manual.
Diagnostics Menu
All inputs, all outputs, all flags, and many counters may be viewed at this
menu. In addition, outputs, flags, and counters may be changed at this
location. For further information, refer to the Software Calibration chapter
of the 6DS-SP Maintenance manual.
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