Strasbaugh 6DS-SP - Page 850

Strasbaugh Software Calibration Procedures
Version 4.0 - February 1998 10 - 159
Turn Machine Power On and Perform Home Sequence Routine
Follow the procedures detailed in the Operator Functions chapter of the 6DS-SP
Operations manual.
B. SET THE VALUE OF VARIABLE 170, WAFER BLOW OFF
PRESSURE AT THE CALIBRATION/CONFIGURATION MENU
Notes:
The range allowed for setting blow off pressure is 0 to 55 psi.
If the pressure is set below 15 psi, the wafer may not blow off the carrier; if the
pressure is set above 45 psi, the carrier may blow off the spindle.
The recommended initial setting is 30 psi.
GOAL: The wafer must blow off the carrier every time,
and
the carrier must never blow off the spindle.
• At the Calibration/Configuration Menu, enter a value for variable 170,
Wafer blow off (psi) of 30.
C. TEST THE NEW SETTING
1. Run an auto cycle using test wafers.
2. Observe:
a. If the wafer does not blow off every time, increase the pressure in 5
psi increments and retest.
b. If the carrier blows off the spindle, decrease the pressure in 5 psi
increments and retest.
3. Repeat setting the variable and testing until the goal is met.