Operations Model 6DS-SP Planarizer
2 - 28 Version 4.0 - February 1998
LEFT/RIGHT LOAD/UNLOAD
STATIONS
Each load station is equipped with a load chuck mounted on an air cylinder
(which raises and lowers the chuck). The load chuck takes vacuum on a
wafer through vacuum ports. The load chuck lowers the wafer into the
centering ring which has beveled sides to aid in centering the wafer in the
ring. A vacuum sensor, mounted on a bracket located on the cabinet wall
adjacent to the load station, notifies the control computer when a wafer is
placed in the ring. A rinse nozzle mounted on each ring wets the wafers
before and after polishing. Load chuck rinsing during polish cycles is
selectable at page 3 of the Machine Parameters Menu with choices available
for rinsing at intervals, rinsing steadily, or no rinsing. Both the left and right
load chucks will be rinsed even if only one spindle is in use. Load chuck
rinsing does not occur in “condition” mode.
The fountain rinse option provides rinsing of the front side of the wafer as
a part of the post polish wafer handling sequence. For machines equipped
with fountain rinsing, the function is enabled at page 3 of the Machine
Parameters Menu.
LEFT/RIGHT CARRIER/WAFER
CLEANING STATIONS
The carrier/wafer cleaning stations rinse and scrub carriers and wafers. The
stations can rinse both carriers and wafers at all times, but they can scrub
only the item (carrier or wafer) for which the appropriate brush is installed.
Each cleaning station is equipped with a cleaning device powered by a
brushless DC servo motor. The cleaning device is mounted on an air
cylinder which raises and lowers the it during cleaning. A rinse nozzle
mounted inside the station sprays D. I. water on the carrier/wafer. Polymer
rollers mounted in each cleaning station permit the carriers/wafers to rotate
during cleaning.
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