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Chapter 1: Introduction
Motherboard Features
Other
• RoHS
Dimensions
• WIO form factor (13.0" x 8.0") (330.20 mm x 203.20 mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con-
guration User's Guide available at http://www.supermicro.com/support/manuals/.
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