To Next PageTo Next PageWhat to do if there is a risk of damaging components nearby while rewelding or disassembling TCL Alcatel Idol4 Cell Phone components?
To prevent damage to nearby components during rewelding or disassembly of TCL Cell Phone components, apply high-temperature adhesive tape to the components in close proximity to the work area.
How to reweld or disassemble/assemble components of TCL Alcatel Idol4 Cell Phone?
To reweld or disassemble/assemble components on your TCL Cell Phone, use a hot wind gun. Set the temperature to 330°C, the air level to 2-3, maintain a height of around 10mm, and apply heat for less than 60 seconds.
Why is the PCBA blistering when heating part of the PCBA with a hot wind gun of TCL Alcatel Idol4 Cell Phone?
If the PCBA of your TCL Cell Phone has been stored for more than 7 days and shows blistering after heating with a hot wind gun, it's likely because it wasn't baked beforehand. Bake the main PCBA in an oven before applying heat.
How to dry a damp PCBA in TCL Cell Phone after long time storage?
If the PCBA of your TCL Cell Phone becomes damp after long-time storage (more than 7 days), bake the main PCBA in an oven. The oven temperature should be 105°C, and the baking time should be greater than 8 hours.
General| Brand | TCL |
|---|---|
| Model | Alcatel Idol4 |
| Category | Cell Phone |
| Language | English |
Verifies warranty status using IMEI and humidity labels.
Assesses physical condition of the device for damage.
Initial checks including SIM, battery, and power-on behavior.
Lists necessary items for software download: handset, PC, USB cable.
Guides on installing necessary drivers for software download.
Step-by-step instructions for downloading software using Sugar QCT_SP tool.
Emphasizes wearing static protection like loops or gloves during disassembly.
Lists required tools for disassembly, e.g., plastic flake, tweezers, screwdriver.
Details the initial steps of disassembling the device, starting with SIM tray and back cover.
Outlines the reverse order of disassembly steps for reassembly, including jig usage.
Provides time, tools, and difficulty class for disassembling various parts.
Troubleshooting for issues with power, charging, display, camera, MIC, speaker, and USB.
Identifies L2 enhance components on the main and sub PCBA.
Detailed steps for diagnosing and resolving common hardware failures.
Lists spare parts required for Level 2 repair.
Guidance on exchanging components like antenna bracket, vibrator, speaker, and camera.
Items to check and validate during the function test phase.
Details unacceptable PCBA appearances like rust, distortion, smudge, and mildew.
Instructions for retaining PCBA labels and proper packing for return.
