L2E Repair Document TCL Communication Ltd.
VF1300 Level 2E Repair Document
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Note: Please always refer to Forlog system for the latest spare part list.
Baseband Chipset,VFBGA,641
Balls,12.6×12.6×0.9 mm
PMU Chipset,VFBGA 206L,6.6×6.6×1.0
mm
Memory,LPDDR3 SDRAM,16 Gb,178-
Ball FBGA,11×11.5×0.78 mm
Memory,e-MMC Module,16 GB,P-
WFBGA153-1113-0.50,11.5×13×0.8
mm
Crystal,32.768 KHz,±20 ppm,12.5
pF,3.2×1.5×0.8 mm
Crystal,26 MHz,±10 ppm,7.8
pF,2.5×2×1 mm
LED Driver,2.92×2.8×0.8 mm,TSOT-
23-6,PWM Dimming,38V Step-Up
Power Inductor,0.33
uH,±20 %,DCR=0.022 ohm
Power Inductor,0.47
uH,±20 %,DCR=0.029 ohm
Power Inductor,1
uH,±20 %,DCR=0.045 ohm
Power Inductor,4.7
uH,±20 %,DCR=0.095 ohm
Power Inductor,4.7
uH,±20 %,DCR=0.14 ohm
Ultra-Low Noise Amplifier,1.1×0.9×0.45
mm,DFN-6L
4-in-1 connectivity chip,Wi-
Fi/BT/FM/GPS,40-Pin QFN,5×5×0.85
mm
Triaxial Accelerate Sensor,2×2×0.95
mm,12-Pin LGA
Transient Voltage Suppressors,15 pF,5
V,SOD882,Bi-Directional
Cannot switch to
headset mode
ESD protection diode,0.85 pF,5.5
V,SOD882,Bi-Directional
No FM radio when plug
in headset
Transient Voltage Suppressors,300
pF,12 V,SOD-123FL,Bi-Directional