Teac CD-3 - Page 5

CD-3
4 ADJUSTMENT AND CHECKS
ase ¢ HERS
1. Replacement of the pickup assembly
@ Before removing the pickup assembly be sure to solder
-bridge where indicated in the inset (Fig. 4-1) to prevent
the laser diode from being electrostatically damaged.
After replacing the pickup assembly, be sure to unsolder
the antistatic bridge. Or else the laser diode does not
function.
@ Before servicing the pickup assembly be sure to prevent
electrostatic-inducer destruction by grounding not only
test equipment in use but also yourself as shown in
Fig. 4-2.
* Electrostatic charge drastically shortens the operating
life of the laser diode or possibly results in its
destruction.
@During the transportation, mounting and dismounting
of the assembly, support with your fingers at points
A and B as shown in Fig. 4-3. Be particularly careful
not to touch the actuator, photosensor and LD plate
and do not apply force to them.
@Soldering must be done quickly at less than 30W, 320°C.
@Don’'t disassemble the pickup ass’y.
@Don't apply shock to the pickup ass’y.
@Don't place the assembly in a place subject to excessive
dust, heat or moisture.
PCB
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Pick-up case
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Fig. 4-1
2. Objective
@Laser beams are similar to infrared rays. Don’t look at
the beams directly and keep your eyes at least 30cm
away from them.
@Don't touch the objective with fingers.
@If objective becomes dirty, playback will deteriorate.
To clean the objective, moisten a good cleaning tissue,
such as made by KODAK, in isopropyl alcohol and wipe
the objective gently. Wipe off and excess fluid with a
dry cleaning tissue.
Resistor
IMQ~10MQ
Photo Sensor
Earth
Fig. 4-2 Fig. 4-3
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