u-blox LEA-5 Series - Page 6

LEA-5, NEO-5, TIM-5H - Hardware Integration Manual
GPS.G5-MS5-09027-A2 Released Contents
Page 6 of 68
2.4 TIM-5H design .................................................................................................................................... 31
2.5 Layout ................................................................................................................................................ 32
2.5.1 Footprint and paste mask ............................................................................................................ 32
2.5.2 Placement ................................................................................................................................... 34
2.5.3 Antenna connection and grounding plane design ....................................................................... 36
2.5.4 Antenna micro strip ..................................................................................................................... 37
2.6 Antenna and antenna supervisor ........................................................................................................ 38
2.6.1 Passive antenna ........................................................................................................................... 39
2.6.2 Active antenna (LEA-5H/5S/5A/5T, TIM-5H) ................................................................................. 39
2.6.3 Active antenna (LEA-5Q/5M, NEO-5) ........................................................................................... 40
2.6.4 Active antenna bias power (LEA-5H/5S/5A/5T, TIM-5H) ............................................................... 41
2.6.5 Active antenna supervisor (LEA-5H/5S/5A/5T, TIM-5H)................................................................. 42
2.7 EOS/ESD/EMI Precautions .................................................................................................................... 46
2.7.1 Abbreviations .............................................................................................................................. 46
2.7.2 Electrostatic discharge (ESD) ........................................................................................................ 46
2.7.3 ESD protection measures ............................................................................................................. 46
2.7.4 Electrical Overstress (EOS) ............................................................................................................ 47
2.7.5 EOS protection measures ............................................................................................................. 47
2.7.6 Electromagnetic interference (EMI) .............................................................................................. 47
2.7.7 GSM applications ........................................................................................................................ 48
2.7.8 Recommended parts ................................................................................................................... 50
3 Handling and soldering ............................................................................................. 51
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 51
3.2 ESD handling precautions ................................................................................................................... 51
3.3 Soldering ............................................................................................................................................ 52
3.3.1 Soldering paste............................................................................................................................ 52
3.3.2 Reflow soldering ......................................................................................................................... 52
3.3.3 Optical inspection ........................................................................................................................ 53
3.3.4 Cleaning ...................................................................................................................................... 53
3.3.5 Repeated reflow soldering ........................................................................................................... 54
3.3.6 Wave soldering............................................................................................................................ 54
3.3.7 Hand soldering ............................................................................................................................ 54
3.3.8 Rework ........................................................................................................................................ 54
3.3.9 Conformal coating ...................................................................................................................... 54
3.3.10 Casting ........................................................................................................................................ 54
3.3.11 Grounding metal covers .............................................................................................................. 55