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General| Navigation Sensitivity | -167 dBm |
|---|---|
| Tracking Sensitivity | -160 dBm |
| Acquisition Sensitivity | -148 dBm |
| Reacquisition Sensitivity | -160 dBm |
| Hot Start Time | 1 s |
| Velocity Accuracy | 0.1 m/s |
| Time Accuracy | 30 ns |
| Update Rate | Up to 10 Hz |
| Supply Voltage | 2.7 V to 3.6 V |
| Protocols | NMEA, UBX binary, RTCM |
| Receiver Type | GPS |
| Frequency | L1 |
| Cold Start Time | 26 s |
| Warm Start Time | 2 s |
| Position Accuracy | 2.5 m |
| Interface | UART, SPI |
| Operating Temperature | -40 to +85 °C |
Details on power supply pins (VCC, VCC_IO, V_BCKP, V_ANT, VDD_USB) and their requirements.
Information on available communication interfaces such as UART, USB, DDC, and SPI.
Description of various input/output pins and their functions, including RESET_N, EXTINT, and TIMEPULSE.
Key items for a simple design check to ensure optimal performance and avoid PCB respins.
Important information for designing a robust GPS/GNSS system, including footprint and placement.
Design considerations for passive and active antennas, including supervision features.
Summary of hardware compatibility issues and changes between u-blox 6 and u-blox 7 series.
Detailed comparison of hardware compatibility across NEO-7, MAX-7, and LEA-7 modules.
Information on software compatibility and changes when migrating from u-blox 6 to u-blox 7 firmware.
Guidelines and recommendations for soldering u-blox 7 modules to PCBs.
Detailed process for reflow soldering, including preheat, heating, and cooling phases.
Essential precautions for protecting modules from Electrical Overstress, Electrostatic Discharge, and Electromagnetic Interference.
Definition and understanding of electrostatic discharge phenomena in electronics.
Guidelines for establishing and maintaining Electrostatic Protective Areas (EPAs) for handling.
Specific measures and recommendations to enhance ESD protection for module designs.
Understanding situations that cause Electrical Overstress and potential damage.
Recommended protection measures to prevent overstress damage, especially near RF emitters.
Identifying sources of EMI and recommended measures for robust grounding and shielding.
