NEO-M9N-Integration manual
• Place RF input matching component close to RF_IN pin.
• Use vias to 3D grounding at ground plane.
• No stubs must occur on the RF input trace.
The RF trace must be shielded by vias to ground along the entire length of the trace and the NEO-
M9N RF_IN pad should be surrounded by vias as shown in the figure below.
Figure 40: RF input trace
The RF_IN trace on the top layer should be referenced to a suitable ground layer.
4.8.4.2 VCC pad
The VCC pad for the NEO-M9N module needs to have as low an impedance as possible with large
vias to the lower power layer of the PCB. The VCC pad needs a large pad and the decoupling capacitor
must be placed as close as possible. This is shown in the figure below.
Figure 41: VCC pad
4.9 Design guidance
4.9.1 General considerations
Check power supply requirements and schematic:
• Is the power supply voltage within the specified range and noise-free?
UBX-19014286 - R07
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