u-blox NINA-B1 Series - Page 4

NINA-B1 series - System Integration Manual
UBX-15026175 - R09 Contents
Page 4 of 49
3.2 Antenna interface ............................................................................................................................... 28
3.2.1 RF transmission line design (NINA-B111 only) .............................................................................. 28
3.2.2 Antenna design (NINA-B111 only) ............................................................................................... 30
3.2.3 On-board antenna design (NINA-B112 only) ................................................................................ 32
3.3 Supply interfaces ................................................................................................................................ 33
3.3.1 Module supply design ................................................................................................................. 33
3.4 Data communication interfaces .......................................................................................................... 33
3.4.1 Asynchronous serial interface (UART) design ............................................................................... 33
3.4.2 Serial peripheral interface (SPI) ..................................................................................................... 34
3.4.3 I
2
C interface................................................................................................................................. 34
3.5 NFC interface ...................................................................................................................................... 34
3.5.1 Battery protection ....................................................................................................................... 34
3.6 General High Speed layout guidelines ................................................................................................. 35
3.6.1 General considerations for schematic design and PCB floor-planning .......................................... 35
3.6.2 Module placement ...................................................................................................................... 35
3.6.3 Layout and manufacturing .......................................................................................................... 35
3.7 Module footprint and paste mask ....................................................................................................... 36
3.8 Thermal guidelines.............................................................................................................................. 36
3.9 ESD guidelines .................................................................................................................................... 36
4 Handling and soldering ............................................................................................. 38
4.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 38
4.2 Handling ............................................................................................................................................. 38
4.3 Soldering ............................................................................................................................................ 38
4.3.1 Reflow soldering process ............................................................................................................. 38
4.3.2 Cleaning ...................................................................................................................................... 39
4.3.3 Other remarks ............................................................................................................................. 40
5 Qualifications and approvals ..................................................................................... 41
6 Product testing ........................................................................................................... 42
6.1 u-blox In-Series production test .......................................................................................................... 42
6.2 OEM manufacturer production test .................................................................................................... 42
6.2.1 “Go/No go” tests for integrated devices ...................................................................................... 43
Appendix .......................................................................................................................... 44
A Glossary ...................................................................................................................... 44
B Antenna reference designs ........................................................................................ 45
B.1.1 Floor plan ......................................................................................................................................... 46
Related documents........................................................................................................... 48
Revision history ................................................................................................................ 48
Contact .............................................................................................................................. 49