Vertex VX-10 Service Manual

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-.,

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~'

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Chip

Component

Information

Replacing Chip Components

Chip

components

are

installed

at

the factory

by

a series

of

robots. The first

one

places a

small

spot

of

adhesive

resin

at

the

location

where

each

part

is

to

be

installed,

and

later

robots

handle

and

place

parts

using

vacuum

suction.

For single

sided

boards,

solder paste is applied

and

the

board

is

then

baked

to

harden

the resin

and

flow the solder.

For

double

sided

boards,

no

solder

paste

is

applied,

but

the

board

is

baked

(or

exposed

to ultra-violet light) to

cure

the

resin

before

dip

soldering.

In

our

laboratories

and

service

shops,

small

quantities of

chip

components

are

mounted

man-

ually

by

applying

a

spot

of

resin,

placing

with

tweezers,

and

then

soldering

by

very

small

dual

streams

of

hot

air

(without

physical contact

dur-

ing

soldering).

We

remove

parts

by

first

remov-

ing

solder

using

a

vacuum

suction

iron,

which

applies

a light

steady

vacuum

at

the iron tip,

and

then

breaking

the

adhesive

with

tweezers.

The

special

vacuum/

desoldering

equipment

is

recommended

if

you

expect to

do

a lot

of

chip

replacements.

Otherwise,

it is

usually

possible

to

remove

and

replace

chip

components

with

only

a

tapered,

temperature-controlled

solder-

ing

iron,

a

set

of

tweezers

and

braided

copper

solder

wick.

Soldering

iron

temperature

should

be

below

280°C (536°F).

VX-10 VHF Band Service Manual

Precautions for Chip Replacement

0

Do

not

disconnect

a

chip

forcefully,

or

the

foil

pattern

may

peel off

the

board.

0

Never

re-use a

chip

component.

Dispose

of

all

removed

chip

components

immediate-

ly

to

avoid

mixing

with

new

parts.

0 Limit

soldering

time to 3

seconds

or

less to

avoid

damaging

the

component

and

board.

Removing

Chip Components

0 Remove the

solder

at

each joint,

one

joint

at

a

time,

using

solder

wick

whetted

with

nona-

cidic fluxes as

shown

below.

Avoid

applying

pressure,

and

do

not

attempt

to

remove

tin-

ning

from

the

chip's

electrode.

~

~

0

Grasp

the

chip

on

both

sides

with

tweezers,

and

gently

twist

the

tweezers

back

and

forth

(to

break

the

adhesive

bond)

while

alternate-

ly

heating

each electrode. Be careful to

avoid

peeling

the

foil traces

from

the

board.

Dispose

of

the

chip

when

removed.

0 After

removing

the

chip,

use

the

copper

braid

and

soldering

iron

to

wick

away

any

excess

solder

and

smooth

the

land

for installation

of

the

replacement

part.

1-3

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Vertex VX-10 Specifications

General

Brand	Vertex
Model	VX-10
Category	Radio
Language	English