Western Digital WDE2170 - Default Chapter; Table of Contents

WD Enterprise WDE2170/WDE4360 Table of Contents
4079-001045 Rev. B RELEASED 04-08-97 i
TT
ABLE OF ABLE OF
CC
ONTENTSONTENTS
1. D
ESCRIPTION AND
F
EATURES
.............................................................................
1
1.1. General Description................................................................................................................. 1
1.2. Advanced Features .................................................................................................................. 2
1.3. Options ...................................................................................................................................3
2. S
PECIFICATIONS
................................................................................................
4
2.1. Performance Specifications...................................................................................................... 4
2.2. Physical Specifications ............................................................................................................ 5
2.2.1. Physical Dimensions.................................................................................................. 6
2.3. Mechanical Specifications.......................................................................................................7
2.3.1. Mounting................................................................................................................. 10
2.4. Electrical Specifications ........................................................................................................ 11
2.4.1. Current Requirements and Power Dissipation.......................................................... 11
2.4.2. 12V Current Profile................................................................................................. 12
2.4.3. Input Voltage Requirements..................................................................................... 13
2.4.4. Ripple...................................................................................................................... 13
2.4.5. Bring-Up Sequence.................................................................................................. 13
2.5. Environmental Specifications................................................................................................ 14
2.5.1. Shock and Vibration................................................................................................ 14
2.5.2. Temperature and Humidity...................................................................................... 16
2.5.3. Cooling.................................................................................................................... 16
2.5.4. Atmospheric Pressure .............................................................................................. 17
2.5.5. Acoustics................................................................................................................. 17
2.6. Reliability Specifications ....................................................................................................... 20
2.7. Agency Approvals................................................................................................................. 20
2.7.1. Product Safety.......................................................................................................... 20
2.7.2. Electromagnetic Compatibility (EMC)..................................................................... 20
3. A
DVANCED
P
RODUCT
F
EATURES
......................................................................
21
3.1. Compatibility Testing............................................................................................................ 21
3.2. SCSI-3 SPI Compliant........................................................................................................... 21
3.3. Embedded Servo Control....................................................................................................... 21
3.4. Read Caching and Pre-Fetch ................................................................................................. 21
3.5. Write Caching....................................................................................................................... 21
3.6. 512 Kilobyte Data Buffer....................................................................................................... 21
3.7. Adaptive Caching.................................................................................................................. 21
3.8. Command Queuing and Reordering....................................................................................... 22
3.9. Media Defect Management.................................................................................................... 22
3.10. Microcode Download............................................................................................................. 22
3.11. Reed Solomon ECC On-the-Fly............................................................................................. 22
3.12. CRC Data Protection............................................................................................................. 22
3.13. Zoned Recording................................................................................................................... 23
3.14. Headerless Format................................................................................................................. 23