Yaesu FTM-400DR/DE - User Manual

Specications
Exploded View & Miscellaneous Parts
Block Diagram
Alignment
Board Unit (Schematics, Layouts & Parts)
MAIN Unit
PANEL Unit
DSP Unit
144/430 MHz 50 W Dual-Band Transceiver
FTM-400DR/DE
TECHNICAL SUPPLEMENT
©2014 YAESU MUSEN CO., LTD. EH034M90B
YAESU MUSEN CO., LTD.
Tennozu Parkside Building
2-5-8 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002 Japan
YAESU USA
6125 Phyllis Drive, Cypress, CA 90630, U.S.A.
YAESU UK
Unit 12, Sun Valley Business Park, Winnall Close
Winchester, Hampshire, SO23 0LB, U.K.
Introduction
This manual provides the technical information necessary for
servicing the FTM-400DR/DE 144/430 MHz 50 W Dual Band
Transceiver.
Servicing this equipment requires expertise in handing surface-
mount chip components. Attempts by non-qualified persons
to service this equipment may result in permanent damage not
covered by the warranty, and may be illegal in some countries.
Two PCB layout diagrams provided for each double-sided
board in this transceiver. Each side of the board is referred to
by the type of the majority of components installed on that side
("Side A" or "Side B"). In most cases one side has only chip
components, and the other has either a mixture of both chip and
leaded components (trimmers, coils, electrolytic capacitors,
ICs, etc.), or leaded components only.
While we believe the information in this manual to be correct,
YAESU assumes no liability for damage that may occur as a
result of typographical or other errors that may be present. Your
cooperation in pointing out any inconsistencies in the technical
information would be appreciated.
Important Note
1) This transceiver was assembled using Pb (lead) free solder, based on the RoHS specication.
Only lead-free solder (Alloy Composition: Sn-3.0Ag-0.5Cu) should be used for repairs performed on this apparatus. The solder stat-
ed above utilizes the alloy composition required for compliance with the lead-free specication, and any solder with the above alloy
composition may be used.
2) Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
Contents

Summary

Specifications

General Specifications

Covers frequency range, channel steps, stability, voltage, consumption, temperature, and size.

Transmitter Specifications

Details RF power output, modulation type, and spurious emissions.

Receiver Specifications

Details circuit type, intermediate frequencies, sensitivity, selectivity, and AF output.

Block Diagram

Alignment Procedures

Alignment Introduction and Precautions

Required Test Equipment for Alignment

Alignment Preparation and Precautions

Internal System Alignment Routine

TX Power Adjustment

Step-by-step guide to adjust transmitter power levels for different bands.

MAIN Unit

MAIN Unit Circuit Diagram

Schematic diagram of the MAIN unit's electronic circuitry.

MAIN Unit Parts List

List of components for the MAIN unit with part numbers and specifications.

PANEL Unit

PANEL Unit Circuit Diagram

Schematic diagram of the PANEL unit's electronic circuitry.

PANEL Unit Parts List

List of components for the PANEL unit with part numbers and specifications.

DSP Unit

DSP Unit Circuit Diagram

Schematic diagram of the DSP unit's electronic circuitry.

DSP Unit Parts List

Yaesu FTM-400DR/DE Specifications

General

Operating Modes	FM, C4FM (Digital)
RF Power Output	50W (VHF), 50W (UHF)
Memory Channels	1000
GPS	Built-in
Supply Voltage	13.8V DC
Frequency Range	144-148 MHz / 430-450 MHz
Channel Steps	5/10/12.5/15/20/25/50 kHz
Display	Color TFT
Weight	1.2 kg
Digital Features	C4FM
APRS	Built-in