SERVICE MANUAL
HAMAMATSU, JAPAN
1.494K-059 Y.K Printed in Japan ’01, 02
SY 011548
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT.................................................................................. 4
CIRCUIT BOARD LAYOUT ................................................................. 6
WIRING............................................................................................... 6
BLOCK DIAGRAM .............................................................................. 7
DISASSEMBLY PROCEDURE ........................................................... 8
LSI PIN DISCRIPTION.......................................................................11
IC BLOCK DIAGRAM........................................................................ 15
DIMENSIONS ................................................................................... 17
CIRCUIT BOARDS ........................................................................... 18
TEST PROGRAM & INITIALIZE ....................................................... 28
MIDI IMPLEMENTATION CHART ..................................................... 40
PARTS LIST
OVERALL CIRCUIT DIAGRAM
This document is printed on chlorine free (ECF) paper with soy ink.
20010301-59800
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